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Grasp Bond EP112 is an ultra-low-viscosity, electrically insulating, two-component warmth curable epoxy system designed for demanding functions requiring optical readability and resistance to chemical substances generally utilized in silicon processing. This text introduces a two-part case research involving a microelectronics fabrication, showcasing EP112’s function in bonding a silicon wafer to a glass substrate.
Half 1: The START Course of and EP112’s Position
Within the first a part of this case research, researchers at Lawrence Livermore Nationwide Laboratory (LLNL) developed an modern Silicon-on-Insulator (SOI) course of referred to as START (Silicon Switch to Arbitrary Substrate). This technique allows the transformation of ordinary bulk silicon wafers with accomplished circuits into SOI-like configurations with out considerably rising manufacturing prices. Through the use of typical fabrication methods, the START course of combines the advantages of bulk silicon electronics with these of SOI expertise whereas sustaining value effectivity.
A crucial step on this course of concerned bonding a silicon wafer to a glass assist substrate. EP112 was chosen because the adhesive of selection attributable to its ultra-low viscosity, robust bonding capabilities, and excessive chemical resistance. The bonded construction finally contributed to the profitable growth of a prototype liquid crystal show (LCD), demonstrating EP112’s effectiveness in microelectronics fabrication.
Half 2: CMOS Wafer Thinning for SEU Resistance
Within the second a part of this research, LLNL researchers utilized EP112 in a novel wafer-thinning course of to reinforce the reliability of CMOS-based built-in circuits (ICs). The target was to scale back susceptibility to Single Occasion Upsets (SEUs) by considerably lowering the cost assortment quantity throughout the silicon substrate.
To realize this, EP112 was used to bond two substrates collectively, guaranteeing a safe attachment all through the wafer-thinning steps. The method concerned a high-temperature alkaline etching step, the place EP112’s superior chemical resistance performed an important function in stopping de-bonding. By sustaining structural integrity underneath these harsh situations, EP112 enabled the profitable completion of the thinning course of, additional demonstrating its suitability for superior semiconductor functions.
To learn extra about the important thing parameters and necessities, and study in regards to the outcomes, please obtain the complete case research right here.
